“Zonal architectures can significantly reduce harness complexity” Zonal architectures promise leaner wiring, but they also raise the stakes for power distribution and fault handling. Manoj Singh of Forvia Hella explains what fail-operational systems must deliver in future vehicles. Benjamin Müller
“Active cooling becomes relevant when thermal limits constrain performance” Rising power demand is forcing the wire harness industry to rethink weight, packaging and thermal limits. Markus Leitner, Director Group Product Management & Business Development at GG Group, explains why system-level integration and active cooling are moving into focus. Benjamin Müller
“Chiplets enable a shift to a true top-down design approach” Chiplets could reshape how automotive electronics platforms are designed and scaled. Bosch’s Michael Schaffert explains where the technology creates value, and what still limits industrial adoption. Benjamin Müller
