Interview with Michael Schaffert, Bosch
“Chiplets enable a shift to a true top-down design approach”
Michael Schaffert studied electrical engineering at the Technical University of Stuttgart.
Michael Schaffert
Chiplets could reshape how automotive electronics platforms are designed and scaled. Bosch’s Michael Schaffert explains where the technology creates value, and what still limits industrial adoption.
As software-defined vehicles and
AI functions increase the complexity of automotive electronics, chiplet architectures are moving into the strategic focus
of OEMs, suppliers and semiconductor companies.
Michael Schaffert, SVP & Head of Chiplet Program at
Bosch, will discuss the technical and business viability of chiplets at the upcoming AEK panel “Chiplets – Technology
& Business Viability”. The panel will be moderated by Dr Mathias Pillin,
Chief Technology Officer Bosch, and will bring together Dr Christoph Grote,
Senior Vice President AI & Innovation at BMW, Joachim Kahmann, Senior Vice
President Purchasing EE & Modules at Stellantis, Harald Kroeger, Head of
Sales & President Automotive at Sima.ai, Michael Schaffert of Bosch and
Christopher Thomas, President of TSMC Europe.
In this interview, Schaffert explains why system
integration, standards, multi-vendor co-design and long-term supply resilience
will determine whether chiplets can become scalable building blocks for future
automotive platforms.
Looking ahead three to five years, what will be the
biggest bottleneck in turning SDV and AI strategies into scalable,
industrialised vehicle platforms?
From a Bosch perspective, the biggest bottleneck will be system integration across hardware, software and multiple
partners. While the technology building blocks already exist, combining
them into standardised, automotive-grade platforms remains highly complex. In
particular, multi-vendor co-design and the lack of mature standards slow down
scalability. The real challenge is turning innovation into robust, repeatable
industrial solutions.
Which decision being made today will most strongly
determine where value is created in the future automotive ecosystem?
The key decision is how to balance fast innovation cycles,
especially in AI, with the long-term requirements of automotive product
lifecycles and supply chains. Choices around platform control, AI sourcing
strategies and supply chain resilience will define where value accumulates.
Unlike other industries, automotive must guarantee availability for more than a
decade while adapting to rapidly evolving semiconductor markets. This creates a
constant trade-off between innovation, cost and long-term stability.
Where do current approaches to SDVs and next-generation E/E architectures still fall short
in real-world programmes?
Current architectures struggle with complexity, cost and
scalability in real-world programmes. The shift to central
compute and zonal architectures has proven more expensive and complex than
initially expected, especially when multiple SoC variants are introduced. In
practice, SoCs still dictate system architectures, rather than being derived
from vehicle requirements. In addition, innovation cycles remain too slow due
to expensive and inflexible monolithic chip development.
How do chiplet architectures change automotive system
design?
Chiplets enable a shift to a
true top-down design approach, starting from vehicle functions rather
than semiconductor constraints. Systems can be decomposed into modular building
blocks that are better aligned with software architecture and functional
chains. This reduces the need for workarounds typically required when adapting
consumer-driven SoCs to automotive needs. As a result, chiplets allow more
tailored, application-specific system design. We can rightly state that a
chiplet-based SoC can be semi-custom silicon.
What are the biggest integration challenges for chiplets
in vehicles?
The main challenge is establishing stable, widely accepted
standards across the entire ecosystem, including tools, software and suppliers.
Without this, multi-vendor integration will
not scale. In addition, achieving sufficient yield and managing defect risks at
chiplet level remain critical, as failures can impact the entire system. These
technical risks directly affect the economic viability of chiplet-based
solutions.
Where do chiplets create real value beyond traditional
SoC approaches?
Chiplets create value by reducing development effort,
improving scalability and accelerating time to
market. They enable a common software architecture across multiple
product variants, avoiding repeated porting efforts. This allows engineering
resources to focus on differentiating features instead of platform bring-up. At
the same time, chiplets lower entry barriers for innovation, enabling
specialised players to contribute targeted functionality such as AI
accelerators.
