Siemens and Saicec accelerate SDV chip validation Siemens and Saicec plan to speed up the validation of automotive chips by applying advanced digital-twin technology. Their joint approach targets faster certification cycles and more reliable system-level testing. ADT editorial team
This was the 13th Conference Bordnetze im Automobil The 13th Conference Bordnetze im Automobil (Automotive Wire Harness & EDS 2025) brought the industry back to Ludwigsburg. International industry experts gathered in the tranquil town near Stuttgart to explore the latest innovations in vehicle wiring systems, E/E architectures, and Software-Defined Vehicles. Benjamin Müller
