“Putting the ghost in the machine” As AI moves from the cloud into the vehicle, compute architectures must deliver low latency, efficiency and scalability. Harald Kroeger of SiMa.ai explains why edge-first AI will shape the next phase of software-defined vehicles. Benjamin Müller
Wolfspeed brings 300-mm SiC wafers to manufacturing maturity Wolfspeed has produced its first single-crystal 300-mm silicon-carbide wafer. The breakthrough marks a structural shift for power electronics, RF applications and future system integration at scale. Nicole Ahner
Continental establishes unit for semiconductors and electronics Continental's automotive division has established a new business unit for the development and production of electronics and semiconductor solutions: Advanced Electronics & Semiconductor Solutions (AESS). The manufacturing partner will be GlobalFoundries. Benjamin Müller
