Joint development strategy
Hyundai Mobis and Qualcomm partner on SDV platforms
Qualcomm EVP Nakul Duggal (left) and Hyundai Mobis EVP Jung Soo-kyung signed the memorandum of understanding at the Hyundai Mobis booth during CES 2026.
Hyundai Mobis
Hyundai Mobis and Qualcomm have announced a strategic collaboration aimed at developing future-ready SDV architectures and advanced driver assistance systems. The partnership targets scalable solutions for fast-growing automotive markets.
Hyundai Mobis and Qualcomm Technologies are deepening their
cooperation to jointly develop next-generation solutions
for software-defined vehicles and advanced driver assistance systems.
The agreement was announced at CES 2026 and formalised through a memorandum of
understanding.
The partnership brings together Hyundai Mobis’ expertise in
system integration, sensor fusion and perception with Qualcomm Technologies’
automotive system-on-chip portfolio. Both companies see the collaboration as a
way to accelerate the deployment of SDV-capable architectures while addressing
regional market requirements more precisely.
Focus on scalable ADAS and emerging markets
The first phase of the collaboration centres on advanced
driving and parking functions built on Qualcomm’s Snapdragon Ride Flex
system-on-chip. These solutions are designed to support a broad range of
vehicle segments, reflecting the growing adoption of
ADAS technologies beyond premium models.
Particular attention is being paid to high-growth markets
such as India, where demand for driver assistance features is rising rapidly
alongside expectations for software-updatable vehicle platforms. By combining
compute performance, energy efficiency and modular system design, the partners
aim to lower integration barriers for OEMs operating in cost-sensitive and
highly competitive environments.
Building blocks for future SDV architectures
Beyond the initial ADAS applications, Hyundai Mobis and
Qualcomm plan to collaborate on more comprehensive SDV solutions. The goal is
to link Hyundai Mobis’ standardised software platforms with Snapdragon
Automotive technologies to improve overall system performance, efficiency and
long-term stability.
From Hyundai Mobis’ perspective, the cooperation fits into a
broader strategy to expand its business beyond traditional automotive
components. At CES 2026, the company hosted a private exhibition area for
selected international customers, underlining its intention to grow in fields
such as software-defined vehicles, robotics and semiconductors through
targeted, high-value partnerships rather than volume-driven showcases.
For Qualcomm, the agreement strengthens its position as a
technology provider for automotive platforms that increasingly rely on
centralised computing and software-centric architectures. Together, the
partners are positioning themselves to support OEMs as vehicle development
shifts from hardware-led programmes to continuously evolving software
platforms.
