Hyundai Mobis and Qualcomm partner on SDV platforms

ADT editorial team ADT editorial team

14 January 2026 - 16:55

1 min

Qualcomm EVP Nakul Duggal (left) and Hyundai Mobis EVP Jung Soo-kyung signed the memorandum of understanding at the Hyundai Mobis booth during CES 2026.

Hyundai Mobis

Hyundai Mobis and Qualcomm have announced a strategic collaboration aimed at developing future-ready SDV architectures and advanced driver assistance systems. The partnership targets scalable solutions for fast-growing automotive markets.

Hyundai Mobis and Qualcomm Technologies are deepening their cooperation to jointly develop next-generation solutions for software-defined vehicles and advanced driver assistance systems. The agreement was announced at CES 2026 and formalised through a memorandum of understanding.

The partnership brings together Hyundai Mobis’ expertise in system integration, sensor fusion and perception with Qualcomm Technologies’ automotive system-on-chip portfolio. Both companies see the collaboration as a way to accelerate the deployment of SDV-capable architectures while addressing regional market requirements more precisely.

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Focus on scalable ADAS and emerging markets

The first phase of the collaboration centres on advanced driving and parking functions built on Qualcomm’s Snapdragon Ride Flex system-on-chip. These solutions are designed to support a broad range of vehicle segments, reflecting the growing adoption of ADAS technologies beyond premium models.

Particular attention is being paid to high-growth markets such as India, where demand for driver assistance features is rising rapidly alongside expectations for software-updatable vehicle platforms. By combining compute performance, energy efficiency and modular system design, the partners aim to lower integration barriers for OEMs operating in cost-sensitive and highly competitive environments.

Building blocks for future SDV architectures

Beyond the initial ADAS applications, Hyundai Mobis and Qualcomm plan to collaborate on more comprehensive SDV solutions. The goal is to link Hyundai Mobis’ standardised software platforms with Snapdragon Automotive technologies to improve overall system performance, efficiency and long-term stability.

From Hyundai Mobis’ perspective, the cooperation fits into a broader strategy to expand its business beyond traditional automotive components. At CES 2026, the company hosted a private exhibition area for selected international customers, underlining its intention to grow in fields such as software-defined vehicles, robotics and semiconductors through targeted, high-value partnerships rather than volume-driven showcases.

For Qualcomm, the agreement strengthens its position as a technology provider for automotive platforms that increasingly rely on centralised computing and software-centric architectures. Together, the partners are positioning themselves to support OEMs as vehicle development shifts from hardware-led programmes to continuously evolving software platforms.