Electric Vehicle Technology

Interview with Martin Hager, Bosch, and Helmut Pritz, MD Elektronik

“High-speed transmission in E/E architectures is unavoidable”

2 min
Two men speaking on a conference stage before a blue logo backdrop, with audience silhouettes in front.
Helmut Pritz (left), a specialist in fibre-optic data transmission and multi-hybrid connector systems, and mechatronics expert Martin Hager together on stage at the Bordnetzkongress in Ludwigsburg.

As zonal architectures and rising data rates reshape vehicle networks, wiring systems face new demands. Bosch’s Martin Hager and MD Elektronik’s Helmut Pritz explain how high-speed integration and multi-hybrid connectors address them.

As software-defined vehicles, ADAS functions and high-speed data transmission increase system complexity, E/E architectures are undergoing a fundamental transformation. Wiring harnesses, connectors and network topologies are becoming strategic components in the transition towards zonal architectures and central compute systems.

Martin Hager, Chief Expert and Director Center of Competence Mechanical Engineering in the division Mobility Electronics at Bosch, and Helmut Pritz, Manager Technical Product Management at MD Elektronik, work precisely in this field. In this joint interview, both experts explain why high-speed integration, standardisation and manufacturability will become decisive factors for the next generation of automotive E/E systems.

ADT: Looking ahead five years, what will be the single biggest challenge for the wiring harness and EDS industry, and why?

If we look back, the challenge was to estimate the introduction of high-speed Ethernet into cars. Today, we see growing volumes and the first new architectures entering car networks. The major challenge for the coming years is to estimate the influence of these new architectures on the wiring harness, including the growing automation required for these products.

Which architectural decision being made today will most strongly determine cost, complexity and flexibility over the next decade?

A real decision has not been made so far, although some OEMs have started to implement zonal architecture. This is the beginning of a possible way to reduce complexity and costs for automotive networks, as well as to gain full flexibility with the integration of SDVs into cars. This step will be the biggest change for the industry, as it will reduce ECUs and wiring harnesses. This will impact Tier suppliers over the next decade.

What is the main technical reason HF integration is becoming unavoidable in future E/E architectures?

HF data rates and the number of connections are increasing in the automotive industry, following the principle of Edholm’s law and driven by ADAS applications and autonomous driving functions. To secure these growing data rates, HF products need to be implemented in cars. In combination with the new architectures, it is unavoidable to implement high-speed transmission in E/E architectures.

Which interface problems appear most often in mixed high-power and high-speed connectors, such as EMC, thermal coupling, contact resistance or packaging?

The integration of high-speed connectors does not necessarily create any issues, with the topics mentioned. But it is crucial to consider the special characteristics of both connector types during connector development. Regarding packaging, there are design-related boundaries to secure. Regarding contact resistance, there is no difference compared to classic high-speed connections. A more highly integrated approach to high-speed connections enables, in several cases, higher robustness due to compacting in the wiring harness connector. In any case, the key is good hardware design to avoid such problems.

What does multi-hybrid mean in terms of manufacturability and serviceability, and what gets harder for production and repair?

Multi-hybrid connectors build the bridge between high density on the PCB and high data rates. They support flexibility in connector setup and help to support automated production. Due to the concentration of applications in such connectors, OEMs will save workload in production; on the other hand, the know-how required for repair work needs to be increased.

If you could standardise one aspect, such as geometry, test methods, materials or qualification, to speed adoption, which would it be and why?

The most cost-effective topic would be to standardise the geometry of the modules, but this is the hardest part to succeed with. The reason is that each OEM has different requirements for its pinning, which is very challenging to bring to consensus.

Large event screen with a farewell message and vehicle image above silhouetted audience members.
The next Bordnetzkongress takes place in Ludwigsburg on 11 and 12 May 2027. Secure your ticket now and join the discussion on future vehicle architectures.