Software Defined Vehicles

Interview with Florian Weig, BMW

How BMW is securing its electronics supply chain

2 min
Speaker on stage beside a large screen at an automotive electronics congress.
In his presentation at the AUTOMOBIL-ELEKTRONIK Kongress 2026, Florian Weig outlined how geopolitical tensions, rising costs and growing technological complexity are reshaping electronics procurement.

Geopolitical tensions, rising costs and growing chip complexity are putting increasing pressure on automotive electronics procurement. At the AEK, BMW’s Florian Weig explained why transparency, standards and new forms of collaboration are becoming critical.

Florian Weig, Senior Vice President Purchasing & Supplier Network Digital at BMW, argues that OEMs need a deeper understanding of the electronics value chain and that standards, transparency and resilient partner networks are becoming increasingly important.

Following his AEK presentation, we spoke with him about supply chain visibility, emerging forms of collaboration and the challenge of balancing global scale with local adaptation. In the interview, Weig explains why he is cautious about the notion of “control” and what China’s digital ecosystem has to do with BMW’s Neue Klasse strategy.

Geopolitical tensions, rising costs and increasing technological complexity are making automotive electronics procurement more challenging. How much control will OEMs need over the electronics value chain in order to remain competitive in the long term?

I am cautious about the word control. It can very quickly lead us towards the mindset that we have to do everything ourselves. That must not be our approach. We need strong partners, and we need confident partners. What we also need, however, is a shared understanding of the challenges we face. One of the biggest challenges for the entire automotive industry at the moment is competitiveness, and closely linked to that is the issue of cost. That is why we need to reach a new level through transparency, collaboration and common standards.

Collaboration is exactly the right keyword. Software, AI, semiconductors and data are becoming increasingly interconnected in the vehicle. Are traditional supplier relationships still sufficient, or does the industry need new roles and forms of cooperation?

In my view, we can no longer think purely in terms of traditional linear supply chains, where an automotive manufacturer has little involvement beyond the first tiers of its supply chain. There are areas where that model still works extremely well. However, particularly in semiconductors and AI, we are currently experiencing such profound change that we can no longer rely on information simply being passed along the chain. We need to find new ways of collaborating across the value chain and in new constellations. The Chiplet CHASSIS initiative is an outstanding example of this. It demonstrates that we are strongest when we work together deep within the value chain and jointly develop new standards for the automotive industry.

Tall blue AEK exhibition banner in a bright indoor space with stairs and windows.
Save the date! The next AUTOMOBIL-ELEKTRONIK Kongress will take place on 22 and 23 June 2027.

The automotive industry is currently searching for the right balance between global scale and local adaptation in many areas. This applies to production and development, but also to procurement and supply chains. How does BMW achieve this balance?

I believe that, as the BMW Group, we are managing this balance very well at the moment. The Neue Klasse fulfils this global ambition while still giving us the flexibility to implement regionally preferred solutions. One example is the Chinese digital ecosystem, which is completely different from the Western one. There is no Spotify there; instead, there is QQ Music. There is WeChat rather than WhatsApp. The key players are different, and customer expectations are different as well. With the Neue Klasse, we maintain a global platform while still being able to address the specific requirements of individual markets at the application layer.